Lead-FreeSolder相关论文
In order to study the influence of the physical state of solder on the interfacial reaction of dip-soldered Sn-3.0Ag-0.5......
Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during So
The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound (IM......
The formation and growth behavior of intermetallic compound (IMC) layers after introducing an electroless Ni-W-P metalli......
Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure......
采用钎料改性工艺制备了Sn-3．5Ag0．6Cu合金，用润湿平衡法测试了液态Sn-3．5Ag0．6Cu钎料在铜基体表面的润湿性，研究了钎料制备工艺、钎剂卤......
无论是环境的要求还是作为竞争的筹码,无铅钎料在表面组装领域中的应用已经是不可回避.然而无铅化仍然存在材料、工艺、设备、系统......
